The University is soliciting prospective proponents to submit proposals for a Plasma-Enhanced Atomic Layer Deposition (ALD) System.
Atomic layer deposition is a technology that deposits materials conformally monolayer by monolayer on substrates. The technique is particularly well-suited to the deposition of very thin dense dielectrics. The technique is high-precision and highly flexible, ideal for Research and Development (R&D), rapid prototyping, and small-batch production. The scope of this project is to select and acquire a plasma-enhanced ALD system for R&D purposes.
The intention of this tender is to acquire a modular high-vacuum plasma-enhanced ALD system designed for the high-uniformity high-density deposition of thin films on substrates of various shapes and sizes, tailor-made for research and prototyping endeavors. This tool will be used to perform rapid prototyping of semiconductor and photonic devices within the ISO-7 (clean room environment) laboratories of the Advanced Research Center (ARC) at the University of Ottawa. The system must be fully automated, is expected to be robust, reliable, require low maintenance and incorporate control software that is flexible, user-friendly and accessible for multiple users, including students. The University greatly values extended warranty and the quality of the included elements. The University is interested in compact floor-standing models of the tool.
Mandatory Requirements:
1. Plasma-Enhanced Atomic Layer Deposition (ALD) system
1.1 Must be able to accommodate up to 200 mm diameter wafers
1.2 Must be able to accommodate smaller diameter wafers (50, 100 mm)
1.3 Must be able to accommodate odd-shaped and odd-sized 2D and 3D samples (e.g., shards, cleaves, squares, rectangles, 3D objects of various shapes...)
1.4 Must support both plasma-enhanced and thermal ALD processes
1.5 Must include ports to enable monitoring via ellipsometry, quartz crystal microbalance and residual gas analyser
1.6 Must include a substrate heater capable of achieving a temperature of at least 400 oC
1.7 Must be able to accomodate at least 4 precursor gases supplied in industry standard (North America) cylinders
1.8 Manifold and precursor lines must be individually heated up to 200 oC (except for water)
1.9 Must be able to accomodate at least 5 input gases (e.g., O2, N2, Ar, NH3, H2)
1.10 Must include an automated load lock with a shared pumping system
1.11 Must include a vapor trap to protect the pump lines and pumps
1.12 Must include gas handling with an ozone generator, mass flow controllers and precursor delivery lines
1.13 Must include an integrated gas cabinet for low-volume precursor cylinders
1.14 Must include all required ancillary equipment such as dry pumps, turbo pumps, chillers, or otherwise necessary for the ALD to meet all Mandatory Technical Requirements.
1.15 Must include only the amount of precursors necessary for the installation, testing and training associated with the growth of Al₂O₃; TMA (Trimethylaluminum) and H₂O.
1.16 Must include only the amount of precursors necessary for the installation, testing and training associated with the growth of HfO2: Tris(dimethylamido)cyclopentadienyl Hafnium, HfCp(NMe2)3; O3; or tetrakis(dimethylamino)hafnium(IV) (Hf(NMe2)4, TDMAHf) and water (H2O).
1.17 Must include only the amount of precursors necessary for the installation, testing and training associated with the growth of SiO2 and Si3N4: silicon tetrachloride (SiCl4) and NH3.
1.18 Must include only the amount of precursors necessary for the installation, testing and training associated with the growth of TiN and TiO2: titanium tetrachloride (TiCl4) and NH3.
2. Accessories
2.1 The solution must include a computer capable of running all required software. The solution must also include all necessary peripherals (monitor, keyboard, mouse, etc). Both desktop computers and laptops are acceptable.
2.2 Must include software capable of controlling the system, storing and implementing recipes, automatically logging tool status and run data, controlling all system parameters and managing all safety features.
3. Other Requirements
3.1 Must include on-site installation, commissioning and compliance testing by a qualified engineer.
3.2 Must include on-site training by a qualified engineer for a minimum of four (4) users. The training must be for a minimum of two (2) business days in length (eight (8) hours per day)
3.3 Must include a minimum of one (1) year of warranty on parts and labour
3.4 Must include perpetual access to manufacturer database of ALD recipes
3.5 Must include perpetual access to technical assistance and precursor advice
3.6 Must include perpetual software maintenance updates
3.7 Submission must include complete room preparation documentation
