Information de base

Numéro de Référence

00002480305

Organisation émettrice

University of British Columbia

Type d’appel d’offres

DDP - Demande de proposition (Formel)

Numéro d’appel d’offres

2020010283

Titre

Die bonder, component placer, and wedge and ball bonder.

Code d’identité d’origine

SCRIBE

Détails

Emplacement

Colombie Britannique

Type d’achat

Non-mentionné

Dates

Publication

2021-01-22 13h15:00 HNE

Date de fermeture

2021-02-04 17h00:00 HNE

Information du contact

Hassan, Mohammed

mohammed.hassan@ubc.ca

Description

REQUEST FOR PROPOSAL (RFP) 2020010283

TITLE: Die bonder, component placer, and wedge and ball bonder..

Supply and install a Die bonder, component placer, and wedge and ball bonder with complete specifications and deliver to the Department of Electrical and Computer Engineering, University of British Columbia, Vancouver Campus, BC, Canada.
This equipment is being procured as part of a Canadian Foundation for Innovation (CFI) and British Columbia Knowledge Development Fund (BCKDF) project, The Silicon Quantum Leap: Tools for Building a Universal Quantum Computer.

Afficher davantage

Dérogation All amendments to the associated notice, including amended documents, plans and specifications (where applicable), are issued on bcbid.gov.bc.ca. MERX asks that you refer to bcbid.gov.bc.ca notice for these amendments. MERX stipulates that potential bidders may also be required to register with the buying authority as a bidder/plan taker. The contact information can be found within the notice abstract.