Basic Information

Reference Number

00002480305

Issuing Organization

University of British Columbia

Solicitation Type

RFP - Request for Proposal (Formal)

Solicitation Number

2020010283

Title

Die bonder, component placer, and wedge and ball bonder.

Source ID

SCRIBE

Details

Location

British Columbia

Purchase Type

Not Stated

Dates

Publication

2021/01/22 01:15:00 PM EST

Closing Date

2021/02/04 05:00:00 PM EST

Contact Information

Hassan, Mohammed

mohammed.hassan@ubc.ca

Description

REQUEST FOR PROPOSAL (RFP) 2020010283

TITLE: Die bonder, component placer, and wedge and ball bonder..

Supply and install a Die bonder, component placer, and wedge and ball bonder with complete specifications and deliver to the Department of Electrical and Computer Engineering, University of British Columbia, Vancouver Campus, BC, Canada.
This equipment is being procured as part of a Canadian Foundation for Innovation (CFI) and British Columbia Knowledge Development Fund (BCKDF) project, The Silicon Quantum Leap: Tools for Building a Universal Quantum Computer.

Disclaimer All amendments to the associated notice, including amended documents, plans and specifications (where applicable), are issued on bcbid.gov.bc.ca. MERX asks that you refer to bcbid.gov.bc.ca notice for these amendments. MERX stipulates that potential bidders may also be required to register with the buying authority as a bidder/plan taker. The contact information can be found within the notice abstract.